PI (Polyimide) Powder, Tsvimbo, Sheet, CNC Dhizaini Zvigadzirwa
Thermosetting polyamides inozivikanwa nekudzikama kwemafuta, yakanaka makemikari kuramba, yakanakisa michina zvimiro, uye hunhu orenji / yero ruvara. Polyamides yakasanganiswa negraphite kana girazi fiber reinforcements ine flexural masimba anosvika 340 MPa (49,000 psi) uye flexural moduli ye21,000 MPa (3,000,000 psi). Thermoses polymer matrix polyamides inoratidza yakaderera kwazvo inokambaira uye yakanyanya kusimba simba. Zvinhu izvi zvinochengetedzwa panguva yekushandiswa nguva dzose kusvika kumatembiricha anosvika 232 °C (450 °F) uye nenzendo pfupi, dzinosvika 704 °C (1,299 °F).[11] Molded polyimide zvikamu uye laminates ane yakanaka kwazvo kupisa kupisa. Tembiricha dzemazuva ese dzekushanda kwezvikamu zvakadaro uye laminates dzinobva ku cryogenic kusvika kune dzinopfuura 260 °C (500 °F). Polyamides zvakare inopokana nekupisa kwemurazvo uye haiwanzo kuda kusanganiswa nezvinodzosa moto. Vazhinji vanotakura UL chiyero cheVTM-0. Polyimide laminates ine flexural simba hafu yeupenyu pa249 °C (480 °F) ye400 maawa.
Mativi emhando yepolyimide haabatike nezvinonyungudutsa nemafuta anowanzo shandiswa - kusanganisira mahydrocarbon, esters, ethers, alcohols uye ferns. Vanodzivisawo maasidhi asina simba asi haakurudzirwi kushandiswa munzvimbo dzine alkalis kana inorganic acids. Mamwe ma polyamides, akadai seCP1 uye CORIN XLS, anonyungudika-anonyungudika uye anoratidza kujeka kwepamusoro. Iyo solubility zvivakwa zvinovakweretesa kune kupfapfaidza uye yakaderera tembiricha kurapa maapplication.
PI Features
PI ndiyo yayo yega flame retardant polymer, isingapise pakupisa kwakanyanya
Mechanical properties yakaderera kunzwa kune tembiricha
Iyo yezvinyorwa ine yakanakisa coloring kugona, inogona kuzadzisa zvakasiyana zvinodiwa zvekufananidza ruvara
Excellent thermal performance: High tembiricha uye yakaderera tembiricha kuramba
Kuita kwakanakisa kwemagetsi: High electric insulation
PI Main Application Field
Inoshandiswa zvakanyanya mumichina, zviridzwa, zvikamu zvemotokari, magetsi nemagetsi, njanji, midziyo yemumba, kutaurirana, machira emuchina, mitambo uye zvigadzirwa zvekutandara, pombi dzemafuta, matangi emafuta uye zvimwe zvigadzirwa zveinjiniya.
Polyimide zvinhu zvakareruka, zvinochinjika, zvinopesana nekupisa uye makemikari. Naizvozvo, anoshandiswa muindasitiri yemagetsi kune tambo dzinochinjika uye sefirimu inodzivirira pane magineti waya. Semuenzaniso, mulaptop komputa, tambo inobatanidza iyo huru logic board kune inoratidzwa (iyo inofanirwa kuchinjika pese panovhurwa laptop kana kuvharwa) inowanzova polyimide base ine conductor copper. Mienzaniso yemafirimu epolyimide anosanganisira Apical, Kapton, UPILEX, VTEC PI, Norton TH neKaptrex.
Imwezve kushandiswa kwepolyimide resin yakaita seyekudzivirira uye passivation layer mukugadzirwa kweIntegrated circuits uye MEMS chips. Iyo polyimide layers ine yakanaka mechanical elongation uye tensile simba, iyo inobatsirawo kunamira pakati pe polyimide layer kana pakati pe polyimide layer uye yakaiswa simbi layer.
| Munda | Application Cases |
| Indasitiri Chikamu | Yepamusoro tembiricha yekuzvinyudza inotakura, compressor piston mhete, chisimbiso mhete |
| Zvishandiso zvemagetsi | Radiators, fan yekutonhodza, mubato wegonhi, chivharo chetangi remafuta, grille inopinza mweya, chivharo chetangi remvura, chibatiso chemwenje |
SPLA-3D Magiredhi uye Tsananguro
| Giredhi | Tsanangudzo |
| SPLA-3D101 | High-performance PLA. PLA inodarika 90%. Yakanaka kudhinda maitiro uye yakakwirira kusimba. Zvakanakira zvakagadzikana kuumba, yakatsetseka kudhinda uye yakanakisamechanical zvivakwa. |
| SPLA-3DC102 | PLA inoverengera 50-70% uye inonyanya kuzadzwa uye kuomeswa. Izvo zvakanakira zvakagadzika kuumba, yakatsetseka kudhinda uye yakanakisa mechanic zvivakwa. |
